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Modular Mesh Type

Modular Wire-mesh type rooms provide the convenience of ¡°hear-through, see-through¡± construction while still providing excellent RF attenuation levels.

 

* ¡°Hear-through, See-through¡± Structure.

* Eliminate the need for additional ventilation.

* Easy assembly.

 

Modular Wire-mesh screen enclosures provide the maximum shielding performance available in a ¡°hear-through, see-through¡± structure.

Will Tech Wire-mesh type rooms are used where absence of a sense of confinement or casual observation from the outside is desirable.

In many applications, Wire-mesh type enclosures eliminate the need for additional ventilation. Where required, exhaust fans or connections to existing air handling systems are easily added. Wire-mesh type panels are very easy to assemble because of the inherent flexibility of the shielding material which requires lower clamping pressures than are generally required with steel and other rigid materials.

Kickplates or protective paneling are used to protect the lower half of both inside and outside of each wall panel. Kickplates are made of an attractive interior paneling.

The lower half of panels can also be constructed with DLS type panel enclosures instead of kickplates or protective paneling.

 

* FEATURES AND BENEFITS

- "Hat & Flat" clamping system for shield integrity.

- Easy visual and verbal communications.

- Durable, expandable, easy to assemble, easy to move.

- Easy to Maintain.

 

* APPLICATIONS

- Product Repair

- Product Calibration

- Production Testing

- EMI/RFI testing and research

- Security

 

* PERFORMANCE CHARACTERISTICS


- Magnetic Field     40dB @ 14KHz

- Electric Field       100dB from 200KHz to 30MHz

- Plane Wave       100dB from 30MHz to 1GHz, 90dB @ 2GHz


 
 

SUMMARY OF SHIELDING SYSTEMS

 

 

 

MODULAR PAN TYPE

MODULAR DLS TYPE

(DOUBLE LAMINATED STEEL)

MODULAR WIRE-MESH TYPE

Construction

 

 

2mm(T) Galvanized Steel

 

 

0.6mm(T) Galvanized Steel

Particle Board

 

Bronze Mesh

Stainless Mesh

Particle Board

Joining Methods

 

 

Bolted through RF Gasketing

 

Bolted through RF Gasketing

 

Stapled &

Bolted through RF Gasketing

 

Typical Attenuation

1. Magnetic (H-Field)

 

 

70dB @ 14KHz

 

60dB @ 14KHz

 

40dB @ 14MHz

 

2. Electric (E-Field)

 

 

110dB

(200KHz to 50MHz)

 

100dB

(10MHz to 30MHz)

 

100dB

(10MHz to 30MHz)

3. Plane Wave

 

 

110dB

(50Mhz to 1GHz)

 

100dB

(30MHz to 1GHz)

 

100dB

(30MHz to 1GHz)

90dB @ 2GHz

4. Microwave

 

 

100dB

(1GHz to 18GHz)

 

100dB

(1GHz to 18GHz)

 

 

Features

 

 

 

Highest Attenuation

No Wooden parts are used

Easy Assembly

 

High Attenuation

Widely used

Easy Assembly

 

¡°Hear-Through

Sea-Through¡±

Light Weight

Installation Cost

 

 

HIGHEST

 

MODERATE

 

LOW

Applications

 

 

- High security communications.

- Data processing centers.

- Sophisticated electronic equipment manufacturing test rooms.

- EMC Product Compliance Testing.

- Production and Quality Product Line.

 

- Areas of high security, such as government or commercial communication centers.

- Data processing centers.

- Test rooms for manufacturing sophisticated electronic equipment.

- EMC Product Compliance Testing.

- Production and Quality Product Line.

- TEMPEST Security Areas.

- Embassies and Consulates.

 

- Product Repair

- Product Calibration

- Production Testing

- EMI/RFI testing and research

- Security